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style=\"margin-top: 0pt; margin-bottom: 0pt; line-height: 1.38; margin-left: 3pt;\"><font color=\"#000000\" face=\"Arial, sans-serif\"><span style=\"white-space-collapse: preserve;\">人工智慧（AI）的迅猛發展正深刻重塑全球產業格局，其核心驅動力來自AI硬體——專用晶片、處理器及加速器的持續突破。市場分析指出，全球AI硬體市場規模於2024年預計達250億美元，2025年更上看313.6億美元。預期市場將以超過20%的年複合成長率（CAGR）高速擴張，至2029年規模可達727.7億美元，2030年則有望突破767億美元。此基礎技術的革新，為智慧製造、未來交通等多元產業的AI應用注入關鍵動能。\n\nAI模型複雜度與數據量的爆炸性增長，對高效能、低功耗運算提出了空前需求。為此，AI晶片（GPU、ASIC、FPGA、TPU等）設計正朝專用化、異質整合及更高能源效率演進。企業亦從純粹依賴雲端，轉向投資自有AI基礎設施，尤重具成本效益的推論解決方案。同時，邊緣AI應用日趨普及，AI個人電腦及行動裝置出貨量料將擴大，例如支援神經處理單元（NPU）的處理器，其2025年銷量預計將較前一年倍增。\n\n除晶片本身，運算架構的革新同樣關鍵。AI資料中心市場規模在2024年估計為136.2億美元，預計2025至2030年間將以28.3%的CAGR增長。此類資料中心配備先進硬體、優化的冷卻與能源管理系統，以應對密集運算挑戰。業界亦積極探索新型運算典範，如受人腦啟發的神經形態晶片，期為下一代AI應用奠定堅實基礎。\n\n硬體層面的精進，直接賦能AI核心技術，並加速其滲透至智慧製造、醫療、金融科技及交通等垂直領域。研究（IBM報告，2022年數據）顯示，2022年全球已有35%的企業導入AI技術，年增4個百分點。AI核心與硬體的每一次迭代，均為整體AI產業生態的繁榮與創新夯實根基。\n台灣在全球半導體與資通訊硬體產業中位居樞紐。面對AI時代的機遇與挑戰，台灣產業界正積極投入AI晶片設計、先進製程及高效能運算解決方案的研發，力求在全球AI硬體革新浪潮中保持領先。\n\n展望未來，AI核心技術與硬體的持續創新，確為推動AI普及、深化產業應用，並最終實現全面智慧社會的關鍵引擎。\n</span></font></p>","coverImagePath":"/api/general/downloadFile?filePath=UserData/WebExpoNewsPics/20250602093046.png","publishAt":"2025-06-02T00:00:00","newsType":"expoNews","category":"01","_language":"zh-TW","ifReleased":true,"ifEnable":true,"createDateTimeUtc":"2025-06-02T01:28:32.03","updateDateTimeUtc":"2025-06-02T01:31:51.363","createBy":"50519C11-C0F7-4DE6-899C-E92DAFC3C3E8","updateBy":"50519C11-C0F7-4DE6-899C-E92DAFC3C3E8","createDateTimeUtc8":"2025-06-02T09:28:32.03","updateDateTimeUtc8":"2025-06-02T09:31:51.363"},"languageButtonsJsonString":"{\n 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